Effect of Interface Relief on the Occurrence of Cracks at the Contact Point of Laser-Direct-Energy-Deposited Copper Alloy and Nickel Base Superalloy

Effect of Interface Relief on the Occurrence of Cracks at the Contact Point of Laser-Direct-Energy-Deposited Copper Alloy and Nickel Base Superalloy

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The relevance of the study is related to the need to join dissimilar copper and nickel alloys by laser direct energy and material deposition (LDED).The purpose of research is studying the distribution of elements, structure, and properties of contact zone of nickel-based super alloy and CuCr1 bronze obtained by direct energy and material deposition with preliminary formation of relief of contact surface.For the purposes of research, Storage Accessories samples were made from UNS C18200 copper alloy CuCr1 without relief, with a relief of 0.5 mm depth, and with a relief of 1 mm depth.The Ni50Cr33W4.

5Mo2.8TiAlNb (EP648) alloy powder was deposited onto the bronze samples with a micro-relief.The deposition was produced by direct injection of energy and material.The influence of interphase interaction of CuCr-chromium carbide system on the possibility of initiation of a crack in the area of carbide secretions is not significant and does not exceed 3.1% according to CIC criterion from the background level for CuCr1 (CIC = 1.

54% for CuCr1-Al4C3 interface and CIC = 3.1% for CuCr1-Cr23C6 interface).An X-ray analysis revealed the presence of tensile Headset residual macro-stresses, arising from differences in thermal expansion coefficients in the CuCr1-EP648 interface area, which may be the main cause of crack formation.Cracks are generated and run along the grain boundaries, on which traces of excretion are visible.The contact surface in the CuCr1-EP648 interface area has no visible defects, which indicates the good adhesion of materials when applying an initial layer of EP648 by LDED.

The presence of a 0.5-mm micro-relief on CuCr1 has a positive effect on the strength of the connection, as it increases the surface area of the contact CuCr1-EP648 and therefore reduces the contact stress of the breakout.